DocumentCode
2480290
Title
P4J-3 Dip-Type Liquid-Phase Sensor Using SH-SAW
Author
Kogai, Takashi ; Yatsuda, Hiromi ; Shiokawa, S.
Author_Institution
Japan Radio Co. Ltd., Fujimino
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
2091
Lastpage
2094
Abstract
This paper describes an SH-SAW based sensor device which can be directly dipped into a liquid. The sensor device is composed of a two-channel SH-SAW delay line on a 36Y-X LiTaO3. Those IDTs are surrounded with epoxy walls with a 50 mum height and a 160 mum thickness. Since the epoxy walls are constructed by a photo-lithography technique using a thick epoxy based photo resist, the thickness of wall can be minimized and as a result the SH-SAW propagation loss due to the walls can be minimized. Glass covers with an epoxy adhesive are attached onto the walls. Then air-cavities above the IDTs can be achieved and the IDTs can be perfectly isolated from the liquid. In this paper, experimental results of 50 MHz dip-type SH-SAW sensors on 36Y-X LiTaO3 are presented. Since the SH-SAW which propagates on the un-metallized propagation area in a liquid with a low permittivity attenuates due to surface skimming bulk wave excitation, the obtained permittivity and conductivity are slightly different from the exact values. In order to improve this drawback, a compensation method is presented.
Keywords
epoxy insulation; interdigital transducers; microsensors; photolithography; surface acoustic wave delay lines; surface acoustic wave sensors; surface acoustic waves; ultrasonic transducers; IDT; LiTaO3; SH-SAW propagation loss; air cavities above; dip-type liquid-phase sensor; electrical conductivity; epoxy adhesive; epoxy walls; frequency 50 MHz; permittivity; photolithography; photoresist; shear horizontal surface acoustic wave based sensor; surface skimming bulk wave excitation; two-channel SH-SAW delay line; Acoustic sensors; Conductivity; Costs; Delay; Electromechanical sensors; Mechanical factors; Metallization; Permittivity; Sensor phenomena and characterization; Sensor systems;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.526
Filename
4410099
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