• DocumentCode
    2480796
  • Title

    Two dimensional quantum net of heavily doped porous silicon

  • Author

    Yamamoto, A. ; Takimoto, M. ; Ohta, T. ; Whitlow, L. ; Miki, K. ; Sakamoto, K. ; Kamisako, K.

  • Author_Institution
    Electrotech. Lab., Japan
  • fYear
    1998
  • fDate
    24-28 May 1998
  • Firstpage
    198
  • Lastpage
    201
  • Abstract
    We produced and measured the thermoelectric(TE) properties of heavily doped p-type porous silicon(PS). Narrow 10 nm holes were formed through the anodic reaction of a p-type silicon wafer in hydrofluoric acid (HF) solution. We measured room temperature TE transport properties such as conductivity, Seebeck coefficient, thermal conductivity and thermal diffusivity perpendicular to the growth direction of nano-holes. Compared to initial silicon substrate we found that porous silicon has seven times lower electrical conductivity, three times larger Seebeck coefficient and four times lower thermal conductivity. The calculated figure-of-merit for porous silicon sample was about 3.5×10-4 K-1 which was five times larger than that of silicon
  • Keywords
    Seebeck effect; electrical conductivity; elemental semiconductors; heavily doped semiconductors; porous semiconductors; semiconductor quantum dots; silicon; thermal conductivity; thermal diffusivity; 10 nm; 2D quantum net; Seebeck coefficient; Si; anodic reaction; electrical conductivity; figure-of-merit; heavily doped porous Si; hydrofluoric acid solution; nano-holes; p-Si wafer substrate; room temperature transport properties; thermal conductivity; thermal diffusivity; thermoelectric properties; Calorimetry; Conductivity measurement; Contacts; Density measurement; Material properties; Reactive power; Silicon; Silver; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
  • Conference_Location
    Nagoya
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4907-5
  • Type

    conf

  • DOI
    10.1109/ICT.1998.740351
  • Filename
    740351