DocumentCode :
2480801
Title :
A comparative study of wearout mechanisms in state-of-art microprocessors
Author :
Chen, Chang-Chih ; Ahmed, Fahad ; Milor, Linda
Author_Institution :
Sch. of Electr. & Comptuer Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
2012
fDate :
Sept. 30 2012-Oct. 3 2012
Firstpage :
271
Lastpage :
276
Abstract :
In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.
Keywords :
benchmark testing; integrated circuit reliability; life testing; microprocessor chips; thermal stresses; electrical stress profiles; lifetime estimation; lifetime-limiting wearout mechanisms; reliability-critical microprocessor functional units; standard benchmarks; state-of-art microprocessor systems; thermal stress profiles; Benchmark testing; Degradation; Dielectrics; Microprocessors; Reliability; Stress; Thermal stresses; Aging; BTDDB; GOBD; Microprocessors; NBTI; PBTI; Reliability; Wearout Mechanisms;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computer Design (ICCD), 2012 IEEE 30th International Conference on
Conference_Location :
Montreal, QC
ISSN :
1063-6404
Print_ISBN :
978-1-4673-3051-0
Type :
conf
DOI :
10.1109/ICCD.2012.6378651
Filename :
6378651
Link To Document :
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