DocumentCode
2480801
Title
A comparative study of wearout mechanisms in state-of-art microprocessors
Author
Chen, Chang-Chih ; Ahmed, Fahad ; Milor, Linda
Author_Institution
Sch. of Electr. & Comptuer Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2012
fDate
Sept. 30 2012-Oct. 3 2012
Firstpage
271
Lastpage
276
Abstract
In this work, we perform a comparative study of different wearout mechanisms affecting the state-of-art microprocessor systems. Taking into account the detailed thermal and electrical stress profiles, we present a methodology to accurately estimate the lifetime due to each mechanism. The lifetime-limiting wearout mechanisms are highlighted using standard benchmarks along with the reliability-critical microprocessor functional units.
Keywords
benchmark testing; integrated circuit reliability; life testing; microprocessor chips; thermal stresses; electrical stress profiles; lifetime estimation; lifetime-limiting wearout mechanisms; reliability-critical microprocessor functional units; standard benchmarks; state-of-art microprocessor systems; thermal stress profiles; Benchmark testing; Degradation; Dielectrics; Microprocessors; Reliability; Stress; Thermal stresses; Aging; BTDDB; GOBD; Microprocessors; NBTI; PBTI; Reliability; Wearout Mechanisms;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Design (ICCD), 2012 IEEE 30th International Conference on
Conference_Location
Montreal, QC
ISSN
1063-6404
Print_ISBN
978-1-4673-3051-0
Type
conf
DOI
10.1109/ICCD.2012.6378651
Filename
6378651
Link To Document