DocumentCode
2480902
Title
Packaging technology for a 10-Gb/s photoreceiver module
Author
Oikawa, Y. ; Kuwatsuka, H. ; Yamamoto, T. ; Ihara, T. ; Hamano, H. ; Minami, T.
Author_Institution
Fujitsu Labs. Ltd., Kawasaki, Japan
fYear
1993
fDate
15-18 Nov 1993
Firstpage
378
Lastpage
379
Abstract
Optical transmission systems of up to 2.4 Gb/s are now commercially available. Current research is striving for 10 Gb/s and higher speeds to meet the increasing need for large-capacity optical transmission systems. We studied packaging design considerations for high-speed photoreceiver modules including the packaging of high-speed ICs, interconnects between photodiodes and ICs, optical coupling methods, and the hermetic sealing of fiber assemblies
Keywords
high-speed optical techniques; modules; optical receivers; packaging; 10 Gbit/s; fiber assemblies; hermetic sealing; high-speed ICs; high-speed photoreceiver modules; interconnects; optical coupling; optical transmission systems; packaging; photodiodes; Assembly; Bonding; High speed optical techniques; Integrated circuit packaging; Lenses; Microoptics; Optical coupling; Optical losses; Photodiodes; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1993. LEOS '93 Conference Proceedings. IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-1263-5
Type
conf
DOI
10.1109/LEOS.1993.379216
Filename
379216
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