• DocumentCode
    2481035
  • Title

    Mitigating NBTI in the physical register file through stress prediction

  • Author

    Kothawade, Saurabh ; Ancajas, Dean Michael ; Chakraborty, Koushik ; Roy, Sanghamitra

  • Author_Institution
    Qualcomm Inc., San Diego, CA, USA
  • fYear
    2012
  • fDate
    Sept. 30 2012-Oct. 3 2012
  • Firstpage
    345
  • Lastpage
    351
  • Abstract
    Degradation of transistor parameter values due to Negative Bias Temperature Instability (NBTI) has emerged as a major reliability problem in current and future transistor generations. NBTI Aging of SRAM cell leads to a lower noise margin, thereby increasing the failure rate. The physical register file, which consists of an array of SRAM cells, can suffer from data loss, leading to system failure. In this paper, we explore a novel approach by investigating NBTI stress and mitigation at the instruction granularity. While a wide range of NBTI stress exists in different registers, the stress induced by specific instructions is highly predictable. Using such a prediction mechanism, we propose an NBTI tolerant power efficient physical register file design. Our approach improves the noise margin in a register file by 20%, 32%, and 125% for the 45nm, 32nm, and 22nm technology nodes, respectively. Overall, we observe 14.8% power saving and a 19.8% area penalty in the register file.
  • Keywords
    SRAM chips; failure analysis; integrated circuit noise; integrated circuit reliability; negative bias temperature instability; NBTI aging; SRAM cell; failure rate; instruction granularity; negative bias temperature instability; noise margin; physical register file design; reliability problem; size 22 nm; size 32 nm; size 45 nm; stress prediction; system failure; transistor generation; transistor parameter value degradation; Degradation; Registers; Reliability; Resource management; Stress; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Design (ICCD), 2012 IEEE 30th International Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    1063-6404
  • Print_ISBN
    978-1-4673-3051-0
  • Type

    conf

  • DOI
    10.1109/ICCD.2012.6378662
  • Filename
    6378662