DocumentCode
2481478
Title
Water in plasma polymerized organosilicon film-structure and electrical properties
Author
Kryszewski, M. ; Tyczkowski, J. ; Kazimierski, P.
Author_Institution
Centre of Molecular & Macromolecular Studies, Polish Acad. of Sci., Lodz, Poland
fYear
1988
fDate
5-8 June 1988
Firstpage
168
Lastpage
171
Abstract
The influence of water absorption on properties of plasma-polymerized organosilicon films, particularly their dielectric behavior and electrical conductivity, is described. It has been found that these materials undergo slight swelling following absorption of water molecules. The presence of water molecules in the form of aggregates strongly bonded to the film structure is responsible for the appearance of phase transition effects at 270 K.<>
Keywords
dielectric thin films; electronic conduction in insulating thin films; organic compounds; permittivity; plasma deposited coatings; solid-state phase transformations; sorption; swelling; H/sub 2/O; aggregates; dielectric behavior; dielectric constant; electrical conductivity; electrical properties; phase transition effects; plasma polymerized organosilicon film; swelling; water absorption; Absorption; Conducting materials; Conductive films; Conductivity; Dielectric films; Dielectric materials; Plasma materials processing; Plasma properties; Polymer films; Water;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
Conference_Location
Cambridge, MA, USA
ISSN
1089-084X
Type
conf
DOI
10.1109/ELINSL.1988.13896
Filename
13896
Link To Document