• DocumentCode
    2481478
  • Title

    Water in plasma polymerized organosilicon film-structure and electrical properties

  • Author

    Kryszewski, M. ; Tyczkowski, J. ; Kazimierski, P.

  • Author_Institution
    Centre of Molecular & Macromolecular Studies, Polish Acad. of Sci., Lodz, Poland
  • fYear
    1988
  • fDate
    5-8 June 1988
  • Firstpage
    168
  • Lastpage
    171
  • Abstract
    The influence of water absorption on properties of plasma-polymerized organosilicon films, particularly their dielectric behavior and electrical conductivity, is described. It has been found that these materials undergo slight swelling following absorption of water molecules. The presence of water molecules in the form of aggregates strongly bonded to the film structure is responsible for the appearance of phase transition effects at 270 K.<>
  • Keywords
    dielectric thin films; electronic conduction in insulating thin films; organic compounds; permittivity; plasma deposited coatings; solid-state phase transformations; sorption; swelling; H/sub 2/O; aggregates; dielectric behavior; dielectric constant; electrical conductivity; electrical properties; phase transition effects; plasma polymerized organosilicon film; swelling; water absorption; Absorption; Conducting materials; Conductive films; Conductivity; Dielectric films; Dielectric materials; Plasma materials processing; Plasma properties; Polymer films; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1988., Conference Record of the 1988 IEEE International Symposium on
  • Conference_Location
    Cambridge, MA, USA
  • ISSN
    1089-084X
  • Type

    conf

  • DOI
    10.1109/ELINSL.1988.13896
  • Filename
    13896