Title :
A system-level VLSI platform for optical interconnection insertion
Author :
Hornak, L.A. ; Tewksbury, S.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., West Virginia Univ., Morgantown, WV, USA
Abstract :
The present paper will briefly review issues in the context of overall intelligent optical interconnection module (IOIM) pair design needs. Emphasis will be given to present design efforts on the electronic virtual optical alignment (EVOA) system with discussion of design results and trade-offs regarding the externally controlled detector array and the array switching network architecture
Keywords :
VLSI; integrated circuit packaging; optical design techniques; optical interconnections; optical switches; optical workshop techniques; switching networks; array switching network architecture; design results; electronic virtual optical alignment system; externally controlled detector array; intelligent optical interconnection module pair design; optical interconnection insertion; review; system-level VLSI platform; Circuits; Fault detection; Optical arrays; Optical design; Optical devices; Optical interconnections; Optical receivers; Packaging; Sensor arrays; Very large scale integration;
Conference_Titel :
Lasers and Electro-Optics Society Annual Meeting, 1993. LEOS '93 Conference Proceedings. IEEE
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-1263-5
DOI :
10.1109/LEOS.1993.379259
