Title :
A blister-test apparatus for studies on the adhesion of materials used for neural electrodes
Author :
Ordonez, Juan ; Boehler, Christian ; Schuettler, Martin ; Stieglitz, Thomas
Author_Institution :
Dept. of Microsyst. Eng. - IMTEK, Univ. of Freiburg, Freiburg, Germany
fDate :
Aug. 30 2011-Sept. 3 2011
Abstract :
A blister test apparatus has been developed, which allows a quantitative adhesion analysis of thin-film metallizations on polymers manufactured in cleanroom conditions suitable for micromachining of neural electrode arrays. The device is capable of pressurizing metallic membranes at wafer level, monitoring the pressure and the height of the developing blister while detecting the moment of delamination, allowing the calculation of the adhesion energy between metal film and polymer. The machine is designed for quantitative long-term studies of materials used in neural microelectrode arrays.
Keywords :
adhesion; arrays; biomedical electrodes; biomedical equipment; biomedical materials; delamination; membranes; metallisation; micromachining; neurophysiology; polymers; pressure measurement; adhesion; blister-test apparatus; metallic membranes; micromachining; neural microelectrode arrays; thin-film metallizations; Adhesives; Delamination; Electrodes; Mathematical model; Monitoring; Polyimides; Electrodes; Neurons; Polymers;
Conference_Titel :
Engineering in Medicine and Biology Society, EMBC, 2011 Annual International Conference of the IEEE
Conference_Location :
Boston, MA
Print_ISBN :
978-1-4244-4121-1
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2011.6090812
