DocumentCode :
2482140
Title :
Thermoelectric properties of segmented Bi2Te3/PbTe
Author :
Koshigoe, M. ; Kudo, Y. ; Hashimoto, M. ; Shiota, I. ; Nishida, I.A.
Author_Institution :
Kogakuin Univ., Tokyo, Japan
fYear :
1998
fDate :
24-28 May 1998
Firstpage :
479
Lastpage :
482
Abstract :
The sintered Bi2Te3 and PbTe compounds were joined by soldering with flux to form segmented materials. The joining with flux was performed under 2 MPa at 650 K for 10s in a N2 atmosphere. Soldering with ultrasonic wave was also attempted. Te-Ag eutectic alloy was used as the solder. SEM observation revealed that the solder did not form any undesirable layer in the vicinity of the joined part in both segmented materials formed by both soldering ways. No remarkable increase in resistivity was observed at the interface. The segmented materials showed higher power factor than each monolithic material at the temperature range between 400 K and 650 K
Keywords :
bismuth compounds; functionally graded materials; lead compounds; scanning electron microscopy; sintering; soldering; thermoelectric conversion; thermoelectricity; 10 s; 2 MPa; 400 to 650 K; Bi2Te3-PbTe; EDX; Hall coefficient; N2; SEM observation; Seebeck coefficient; Te-Ag; Te-Ag eutectic alloy; elemental distribution; flux; functionally graded materials; morphology; power factor; resistance; resistivity; segmented Bi2Te3/PbTe; sintered Bi2Te3; sintered PbTe; soldering; thermoelectric properties; ultrasonic wave soldering; Atmosphere; Bismuth; Conductivity; Inorganic materials; Joining materials; Raw materials; Soldering; Tellurium; Temperature distribution; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
Conference_Location :
Nagoya
ISSN :
1094-2734
Print_ISBN :
0-7803-4907-5
Type :
conf
DOI :
10.1109/ICT.1998.740422
Filename :
740422
Link To Document :
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