• DocumentCode
    2482345
  • Title

    Simulation of partial discharge within a void under square waveform applied voltage

  • Author

    Illias, H.A. ; Bakar, A.H.A. ; Mokhlis, H. ; Tunio, M.A. ; Chen, G. ; Lewin, P.L. ; Ariffin, A.M.

  • Author_Institution
    Electr. Eng. Dept., Univ. of Malaya, Kuala Lumpur, Malaysia
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    76
  • Lastpage
    79
  • Abstract
    Partial discharge (PD) activity within a void in a dielectric material is influenced by many factors. One of the factors is the applied voltage waveform on the material. In this paper, a two-dimensional (2D) model of a cylindrical void in polyethylene layers has been developed using finite element analysis (FEA) software. The model was used to simulate PD activity in the void under square waveform applied voltage. The obtained simulation results were compared with the measurement results from literature. It was found that both results are within reasonable agreement but with only slight disagreement. From comparison, critical parameters from the model affecting PD activity under square waveform applied voltage were identified; they include the inception and extinction voltages and electron generation rate. This finding may increase an understanding of PD behaviour within a void in a dielectric material under square waveform applied voltage.
  • Keywords
    dielectric materials; finite element analysis; partial discharges; voids (solid); 2D model; FEA software; PD activity; cylindrical void; dielectric material; electron generation rate; extinction voltages; finite element analysis; inception voltages; partial discharge simulation; polyethylene layers; square waveform applied voltage; two-dimensional model; Dielectric materials; Electric fields; Electrodes; Partial discharges; Polyethylene; Simulation; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378726
  • Filename
    6378726