DocumentCode
2482345
Title
Simulation of partial discharge within a void under square waveform applied voltage
Author
Illias, H.A. ; Bakar, A.H.A. ; Mokhlis, H. ; Tunio, M.A. ; Chen, G. ; Lewin, P.L. ; Ariffin, A.M.
Author_Institution
Electr. Eng. Dept., Univ. of Malaya, Kuala Lumpur, Malaysia
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
76
Lastpage
79
Abstract
Partial discharge (PD) activity within a void in a dielectric material is influenced by many factors. One of the factors is the applied voltage waveform on the material. In this paper, a two-dimensional (2D) model of a cylindrical void in polyethylene layers has been developed using finite element analysis (FEA) software. The model was used to simulate PD activity in the void under square waveform applied voltage. The obtained simulation results were compared with the measurement results from literature. It was found that both results are within reasonable agreement but with only slight disagreement. From comparison, critical parameters from the model affecting PD activity under square waveform applied voltage were identified; they include the inception and extinction voltages and electron generation rate. This finding may increase an understanding of PD behaviour within a void in a dielectric material under square waveform applied voltage.
Keywords
dielectric materials; finite element analysis; partial discharges; voids (solid); 2D model; FEA software; PD activity; cylindrical void; dielectric material; electron generation rate; extinction voltages; finite element analysis; inception voltages; partial discharge simulation; polyethylene layers; square waveform applied voltage; two-dimensional model; Dielectric materials; Electric fields; Electrodes; Partial discharges; Polyethylene; Simulation; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location
Montreal, QC
ISSN
0084-9162
Print_ISBN
978-1-4673-1253-0
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2012.6378726
Filename
6378726
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