DocumentCode :
2482617
Title :
Thermoelectric properties of boron and boron phosphide CVD wafers
Author :
Kumashiro, Y. ; Yokoyama, T. ; Ando, Y.
Author_Institution :
Fac. of Eng., Yokohama Nat. Univ., Japan
fYear :
1998
fDate :
24-28 May 1998
Firstpage :
591
Lastpage :
594
Abstract :
The electrical conductivity of amorphous boron wafers obeys Mott´s T-1/4 rule. BP and B12P2 show band conduction. The thermoelectric power of polycrystalline B decreases with increasing temperature, while that of amorphous B is almost constant in a wide temperature range. That of BP increases with increasing temperature and becomes constant between 600 and 1100 K, while that of B 12P2 shows a high value of 800-1000 μ V/K at 400-800 K. The weak temperature dependences of thermal conductivities of BP and B12P2 polycrystalline wafers reflect phonon scattering by grain boundaries while that of amorphous boron is almost constant in a wide temperature range, showing a characteristic of a glass. The figure of merit for polycrystalline BP is 10-7/K at high temperatures while that of amorphous B is 10-5/K, being promising for thermoelectric devices. Low electrical conductivity of B12P2 produces a lower thermoelectric figure of merit than BP by two orders of magnitude, despite the high thermoelectric power
Keywords :
CVD coatings; boron; boron compounds; electrical conductivity; elemental semiconductors; grain boundaries; semiconductor materials; thermal conductivity; thermoelectric power; 400 to 1100 K; B; B12P2; BP; CVD wafers; amorphous wafers; electrical conductivity; figure of merit; grain boundaries; phonon scattering; temperature dependence; thermal conductivity; thermoelectric power; Amorphous materials; Boron; Glass; Grain boundaries; Phonons; Scattering; Temperature dependence; Temperature distribution; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
Conference_Location :
Nagoya
ISSN :
1094-2734
Print_ISBN :
0-7803-4907-5
Type :
conf
DOI :
10.1109/ICT.1998.740448
Filename :
740448
Link To Document :
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