• DocumentCode
    2483371
  • Title

    Dielectric properties and PD resistance of epoxy/fumed and precipitated silica and alumina nanocomposites

  • Author

    Tanaka, Toshikatsu ; Iizuka, Tomonori ; Meichsner, Christian ; Gröppel, Peter ; Heinl, Dieter ; Weidner, Jürgen R.

  • Author_Institution
    IPS Grad. Sch., Waseda Univ., Kitakyushu, Japan
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    279
  • Lastpage
    282
  • Abstract
    Epoxy/fumed and precipitated silica and alumina nanocomposites were evaluated on their dielectric properties and partial discharge (PD) resistance. Dielectric properties, i.e., permittivity and dissipation factor tanδ were measured in the frequency range from 20 Hz to 1 MHz. PD resistance was assessed using a rod-to-plane electrode with an air gap 0.2 mm under 4 kVrms. A new discovery was made for moisture and chemical residue effects for the dielectric properties. Natural moisture would not affect much permanent dielectric properties. It was elucidated that nano filler addition would enhance PD resistance, as expected. Furthermore, it was found that epoxy/silica nanocomposite is better in PD resistance than epoxy/alumina nanocomposite. Filler preparation methods, i.e., fumed and precipitated, might influence both properties.
  • Keywords
    alumina; nanocomposites; partial discharges; permittivity; resins; silicon compounds; SiO2-Al2O3; alumina nanocomposite; chemical residue; dielectric properties; dissipation factor; epoxy-fumed nanocomposite; epoxy-silica nanocomposite; natural moisture; partial discharge resistance; permittivity; precipitated silica nanocomposite; Dielectrics; Moisture; Nanocomposites; Partial discharges; Permittivity; Resistance; Silicon compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378775
  • Filename
    6378775