DocumentCode :
2483590
Title :
Process influence on the moisture absorption in a polymer nanocomposite
Author :
Saysouk, F. ; Diaham, S. ; Locatelli, M.-L. ; Schlegel, B. ; Salles, V. ; Valdez-Nava, Z. ; Kozako, M. ; Lebey, T. ; Flahaut, E.
Author_Institution :
INPT, Univ. de Toulouse; UPS, Toulouse, France
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
327
Lastpage :
330
Abstract :
A polymer nanocomposite (P-NC) has been manufactured using different processes based on ultrasonication (US) and particles surface treatment. The moisture absorption was detected with different characterization method such as Fourier transform infrared spectroscopy, isothermal thermogravimetric analysis and electrical characterizations. The use of particle surface treatment allows decreasing O-H absorption into P-NC. Moreover, an efficient US process has been found to improve the P-NC hydrophobicity. The desorption kinetics of moisture has also been studied for different P-NC preparation processes, using isothermal characterizations at 150°C. By controlling the chemical surface state of the nanofillers and the dispersion, it was observed a good stability of the conduction current density, in the same order of that of the base polymer.
Keywords :
Fourier transform spectroscopy; current density; desorption; filled polymers; hydrophobicity; infrared spectroscopy; moisture; nanofabrication; polymer insulators; surface states; surface treatment; thermal analysis; Fourier transform infrared spectroscopy; P-NC preparation process; base polymer; chemical surface state control; conduction current density; electrical characterizations; hydrophobicity; isothermal thermogravimetric analysis; moisture absorption; nanofiller; particle surface treatment; polymer nanocomposite; temperature 150 degC; ultrasonication; Absorption; Current density; Isothermal processes; Moisture; Polymers; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378787
Filename :
6378787
Link To Document :
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