DocumentCode
2483656
Title
Experimental study on electrical breakdown of Micro-Electro-Mechanical Systems with micro-gaps
Author
Cheng, Yonghong ; Meng, Guodong ; You, XiaoGuang ; Chen, Liang ; Wu, Kai ; Pan, Cheng
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
339
Lastpage
342
Abstract
To examine and evaluate for providing the guidelines of insulation design in Micro-Electro-Mechanical Systems (MEMS) devices, the samples prepared by etching insulation gaps measured from 5 to 40 μm were investigated in this paper. The pre-breakdown current-voltage curves and relationships between breakdown voltages and gap widths were obtained on test samples fabricated with aluminum film electrodes in standard MEMS processes. Combined with observation of electrode surface by scanning electron microscopy (SEM), breakdown mechanism of MEMS planar electrode structures was discussed. Results show that the pre-breakdown current lies between 1 nA and 100 nA, and Fowler-Nordheim plot verifies that field emission don´t dominate the breakdown process, which don´t agree with many studies. Instead Townsend avalanche mechanism could still be used to explain the gap breakdown in the range of 5 μm to 40 μm, but the minimum breakdown voltages need to be modified for micro scale electrodes. SEM analysis shows that the breakdown damage is crater-like and anode surface suffers more damage. Paschen´s curves for describing the electric breakdown phenomena of gaseous dielectrics needs to be re-examined for designs and operations of MEMS to avoid or to encourage breakdown.
Keywords
electric breakdown; electrodes; etching; insulation; micromechanical devices; scanning electron microscopy; Fowler-Nordheim plot; MEMS devices; MEMS planar electrode structures; Paschen curves; SEM; SEM analysis; Townsend avalanche mechanism; aluminum film electrodes; anode surface; breakdown damage; breakdown mechanism; breakdown voltages; current 1 nA to 100 nA; electric breakdown phenomena; electrical breakdown; electrode surface observation; etching insulation gaps; gap breakdown; gap widths; gaseous dielectrics; insulation design; micro scale electrodes; microelectro-mechanical systems; microgaps; minimum breakdown voltages; pre-breakdown current; pre-breakdown current-voltage curves; scanning electron microscopy; size 5 mum to 40 mum; standard MEMS processes; test samples fabrication; Electric breakdown; Electrodes; Insulation; Materials; Micromechanical devices; Surface morphology; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location
Montreal, QC
ISSN
0084-9162
Print_ISBN
978-1-4673-1253-0
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2012.6378790
Filename
6378790
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