Title :
Experimental study on electrical breakdown of Micro-Electro-Mechanical Systems with micro-gaps
Author :
Cheng, Yonghong ; Meng, Guodong ; You, XiaoGuang ; Chen, Liang ; Wu, Kai ; Pan, Cheng
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´´an Jiaotong Univ., Xi´´an, China
Abstract :
To examine and evaluate for providing the guidelines of insulation design in Micro-Electro-Mechanical Systems (MEMS) devices, the samples prepared by etching insulation gaps measured from 5 to 40 μm were investigated in this paper. The pre-breakdown current-voltage curves and relationships between breakdown voltages and gap widths were obtained on test samples fabricated with aluminum film electrodes in standard MEMS processes. Combined with observation of electrode surface by scanning electron microscopy (SEM), breakdown mechanism of MEMS planar electrode structures was discussed. Results show that the pre-breakdown current lies between 1 nA and 100 nA, and Fowler-Nordheim plot verifies that field emission don´t dominate the breakdown process, which don´t agree with many studies. Instead Townsend avalanche mechanism could still be used to explain the gap breakdown in the range of 5 μm to 40 μm, but the minimum breakdown voltages need to be modified for micro scale electrodes. SEM analysis shows that the breakdown damage is crater-like and anode surface suffers more damage. Paschen´s curves for describing the electric breakdown phenomena of gaseous dielectrics needs to be re-examined for designs and operations of MEMS to avoid or to encourage breakdown.
Keywords :
electric breakdown; electrodes; etching; insulation; micromechanical devices; scanning electron microscopy; Fowler-Nordheim plot; MEMS devices; MEMS planar electrode structures; Paschen curves; SEM; SEM analysis; Townsend avalanche mechanism; aluminum film electrodes; anode surface; breakdown damage; breakdown mechanism; breakdown voltages; current 1 nA to 100 nA; electric breakdown phenomena; electrical breakdown; electrode surface observation; etching insulation gaps; gap breakdown; gap widths; gaseous dielectrics; insulation design; micro scale electrodes; microelectro-mechanical systems; microgaps; minimum breakdown voltages; pre-breakdown current; pre-breakdown current-voltage curves; scanning electron microscopy; size 5 mum to 40 mum; standard MEMS processes; test samples fabrication; Electric breakdown; Electrodes; Insulation; Materials; Micromechanical devices; Surface morphology; Surface treatment;
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
DOI :
10.1109/CEIDP.2012.6378790