Title :
Interconnection reliability
Author :
Reagor, Barbara T.
Author_Institution :
Bell Commun. Res. Inc., Red Bank, NJ, USA
Abstract :
The key factors that can affect interconnection reliability at all levels are summarized. They are manufacturing contamination, materials selection, lubrication, and environmental protection. Actual field failures are discussed
Keywords :
electrical contacts; environmental testing; failure analysis; reliability; environmental protection; field failures; interconnection reliability; key factors; lubrication; manufacturing contamination; materials selection; Contamination; Digital systems; Lubrication; Manufacturing; Packaging; Semiconductor device manufacture; Stability; Switches; Telecommunication network reliability; Wire;
Conference_Titel :
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location :
Los Angeles, CA
DOI :
10.1109/ECC.1988.12592
