DocumentCode
2484547
Title
Polymer composites having large content of nanofiller: A case study involving epoxy
Author
Fréchette, M.F. ; Preda, Oana ; Krivda, A. ; Veillette, R. ; Trudeau, M. ; Vaughan, A. ; David, Eric ; Couderc, H. ; Vanga, C. ; Castellon, J.
Author_Institution
Inst. de Recherde d´´Hydro-Quebec (IREQ), QC, Canada
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
541
Lastpage
546
Abstract
The situation where the polymer nanocomposite contains a large amount of organic filler was studied. An epoxy nanocomposite having a content of 20% wt of nanosilica was used. Emphasis was put on imaging at nanoscale and some dielectric responses were measured using dielectric spectroscopy. Using HAAD mode, an area of less than 4 nm surrounding an isolated particle was imaged and found to have a very low atomic number. Only with AFM in peak-force mode that agglomerates were clearly detected. Relative to the dielectric response, no interfacial relaxation peak was observed. In spite of some agglomeration, the real part of the permittivity was found to be increased by the adjunct of the nanofiller.
Keywords
atomic force microscopy; filled polymers; nanocomposites; nanoparticles; silicon compounds; AFM; HAAD mode; SiO2; atomic number; dielectric responses; dielectric spectroscopy; epoxy; interfacial relaxation peak; isolated particle; nanofiller; nanosilica; organic filler; peak-force mode; permittivity; polymer composites; Dielectrics; Microstructure; Nanoparticles; Polymers; Scanning electron microscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location
Montreal, QC
ISSN
0084-9162
Print_ISBN
978-1-4673-1253-0
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2012.6378838
Filename
6378838
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