DocumentCode :
2484547
Title :
Polymer composites having large content of nanofiller: A case study involving epoxy
Author :
Fréchette, M.F. ; Preda, Oana ; Krivda, A. ; Veillette, R. ; Trudeau, M. ; Vaughan, A. ; David, Eric ; Couderc, H. ; Vanga, C. ; Castellon, J.
Author_Institution :
Inst. de Recherde d´´Hydro-Quebec (IREQ), QC, Canada
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
541
Lastpage :
546
Abstract :
The situation where the polymer nanocomposite contains a large amount of organic filler was studied. An epoxy nanocomposite having a content of 20% wt of nanosilica was used. Emphasis was put on imaging at nanoscale and some dielectric responses were measured using dielectric spectroscopy. Using HAAD mode, an area of less than 4 nm surrounding an isolated particle was imaged and found to have a very low atomic number. Only with AFM in peak-force mode that agglomerates were clearly detected. Relative to the dielectric response, no interfacial relaxation peak was observed. In spite of some agglomeration, the real part of the permittivity was found to be increased by the adjunct of the nanofiller.
Keywords :
atomic force microscopy; filled polymers; nanocomposites; nanoparticles; silicon compounds; AFM; HAAD mode; SiO2; atomic number; dielectric responses; dielectric spectroscopy; epoxy; interfacial relaxation peak; isolated particle; nanofiller; nanosilica; organic filler; peak-force mode; permittivity; polymer composites; Dielectrics; Microstructure; Nanoparticles; Polymers; Scanning electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378838
Filename :
6378838
Link To Document :
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