• DocumentCode
    2484547
  • Title

    Polymer composites having large content of nanofiller: A case study involving epoxy

  • Author

    Fréchette, M.F. ; Preda, Oana ; Krivda, A. ; Veillette, R. ; Trudeau, M. ; Vaughan, A. ; David, Eric ; Couderc, H. ; Vanga, C. ; Castellon, J.

  • Author_Institution
    Inst. de Recherde d´´Hydro-Quebec (IREQ), QC, Canada
  • fYear
    2012
  • fDate
    14-17 Oct. 2012
  • Firstpage
    541
  • Lastpage
    546
  • Abstract
    The situation where the polymer nanocomposite contains a large amount of organic filler was studied. An epoxy nanocomposite having a content of 20% wt of nanosilica was used. Emphasis was put on imaging at nanoscale and some dielectric responses were measured using dielectric spectroscopy. Using HAAD mode, an area of less than 4 nm surrounding an isolated particle was imaged and found to have a very low atomic number. Only with AFM in peak-force mode that agglomerates were clearly detected. Relative to the dielectric response, no interfacial relaxation peak was observed. In spite of some agglomeration, the real part of the permittivity was found to be increased by the adjunct of the nanofiller.
  • Keywords
    atomic force microscopy; filled polymers; nanocomposites; nanoparticles; silicon compounds; AFM; HAAD mode; SiO2; atomic number; dielectric responses; dielectric spectroscopy; epoxy; interfacial relaxation peak; isolated particle; nanofiller; nanosilica; organic filler; peak-force mode; permittivity; polymer composites; Dielectrics; Microstructure; Nanoparticles; Polymers; Scanning electron microscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
  • Conference_Location
    Montreal, QC
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4673-1253-0
  • Electronic_ISBN
    0084-9162
  • Type

    conf

  • DOI
    10.1109/CEIDP.2012.6378838
  • Filename
    6378838