DocumentCode :
2485556
Title :
Improvements to the erosion resistance of nanofilled silicone rubber composites by electrospinning
Author :
Bian, Shanshan ; Jayaram, Shesha H. ; Cherney, Edward A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Waterloo, Waterloo, ON, Canada
fYear :
2012
fDate :
14-17 Oct. 2012
Firstpage :
741
Lastpage :
744
Abstract :
In this study, two-part room temperature vulcanizing silicone rubber (SiR) nanocomposite samples containing 7 nm sized fumed silica and 1.5 μm sized silica, were prepared by conventional mechanical mixing and by electrospinning, and their erosion resistance compared by the ASTM D2303 inclined plane (IPT) test. An improved dispersion of nanofiller in SiR was achieved by electrospinning thereby permitting the preparation of highly filled nano and micro sized composites. The results of eroded mass in the laser ablation tests, and tracking voltage and tracking time in the inclined plane test clearly shows improvements of the electrospun samples over conventional mixed samples. Further, observations of the uniform tracking patterns and hardness measurement after the IPT were indicators of improved filler dispersion in the electrospun samples.
Keywords :
electrospinning; erosion; hardness; nanocomposites; silicone rubber; ASTM D2303 inclined plane test; IPT test; SiR nanocomposite; electrospinning; electrospun samples; erosion resistance; hardness measurement; improved filler dispersion; mechanical mixing; microsized composites; nanofilled silicone rubber composites; nanofiller dispersion; size 1.5 mum; size 7 nm; temperature 293 K to 298 K; two-part room temperature vulcanizing silicone rubber; uniform tracking patterns; Degradation; Dielectrics; Dispersion; Insulation life; Polymers; Resistance; Rubber;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location :
Montreal, QC
ISSN :
0084-9162
Print_ISBN :
978-1-4673-1253-0
Electronic_ISBN :
0084-9162
Type :
conf
DOI :
10.1109/CEIDP.2012.6378887
Filename :
6378887
Link To Document :
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