Title :
Optimization of heat sink EMI using Design of Experiments with numerical computational investigation and experimental validation
Author :
Manivannan, Siyamalan ; Arumugam, R. ; Devi, S. Prasanna ; Paramasivam, S. ; Salil, P. ; Subbarao, B.
Author_Institution :
Electr. & Electron. Dept., Anna Univ. Chennai, Chennai, India
Abstract :
This paper presents a technique for the minimization of electromagnetic radiation from the flat plate heat sink by optimizing the heat sink geometry parameters using Taguchi Design of Experiments technique. The heat sink is modelled and simulated using numerical method via Ansoft HFSS software. Experimental investigation on the heat sink was performed in a shielded semi anechoic chamber confirming to FCC/CISPR requirements for EMC measurements. The experimental results were found to have good concurrence with the simulated results. The L27 combinations (6 factors, 3 levels) were generated by the Taguchi´s Design of Experiments with orthogonal array method using Minitab software. The L27 combinations generated were analysed for radiated emission via simulation. The parameters considered for optimization are the Length and Width of the heat sink, Fin height, Base height, Number of fins and Fin thickness. With the results available for each of the 27 combinations, ANOVA test was carried out for finding out the contribution and impact of each heat sink design parameter towards the radiated emission by the heat sink.
Keywords :
Taguchi methods; anechoic chambers (electromagnetic); design of experiments; electromagnetic interference; electronic engineering computing; heat sinks; ANOVA test; Ansoft HFSS software; Minitab software; Taguchi design of experiments; electromagnetic interference; fin thickness; flat plate heat sink; heat sink geometry; orthogonal array method; shielded semi anechoic chamber; Analysis of variance; Antenna measurements; Computational modeling; Frequency domain analysis; Geometry; Heat sinks; Optimization;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
Print_ISBN :
978-1-4244-6305-3
DOI :
10.1109/ISEMC.2010.5711288