• DocumentCode
    2486434
  • Title

    Efficient macromodeling of power-bus structures based on 2D-integral equation approach

  • Author

    Leone, M. ; Kröning, O.

  • Author_Institution
    Dept. of Theor. Electr. Eng., Otto-von-Guericke Univ. of Magdeburg, Magdeburg, Germany
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    390
  • Lastpage
    395
  • Abstract
    A numerically very efficient simulation method for the analysis of arbitrarily shaped power-bus structures on printed-circuit boards is presented. It is based on a 2D contour integral-equation method in combination with a subsequent macromodeling step, for simulation in time- and frequency domain. For this purpose a vector-fitting approach is applied, yielding a SPICE-compatible equivalent circuit representation of the power bus. The presented approaches allow us to embed the power planes as a linear N port into a circuit simulator, in order to perform a complete analysis of a power-bus system with active and passive components and the complete decoupling circuitry. The accuracy of the suggested method is validated by independent 3D-full wave simulations and experimental results.
  • Keywords
    SPICE; circuit simulation; integral equations; printed circuits; time-frequency analysis; 2D-integral equation approach; SPICE-compatible equivalent circuit; circuit simulator; linear N port; power-bus structure; printed-circuit boards; subsequent macromodeling step; time-and frequency domain; vector-fitting approach; Capacitors; Computer integrated manufacturing; Equations; Frequency response; Impedance; Integrated circuit modeling; Mathematical model;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
  • Conference_Location
    Fort Lauderdale, FL
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4244-6305-3
  • Type

    conf

  • DOI
    10.1109/ISEMC.2010.5711306
  • Filename
    5711306