DocumentCode :
2486434
Title :
Efficient macromodeling of power-bus structures based on 2D-integral equation approach
Author :
Leone, M. ; Kröning, O.
Author_Institution :
Dept. of Theor. Electr. Eng., Otto-von-Guericke Univ. of Magdeburg, Magdeburg, Germany
fYear :
2010
fDate :
25-30 July 2010
Firstpage :
390
Lastpage :
395
Abstract :
A numerically very efficient simulation method for the analysis of arbitrarily shaped power-bus structures on printed-circuit boards is presented. It is based on a 2D contour integral-equation method in combination with a subsequent macromodeling step, for simulation in time- and frequency domain. For this purpose a vector-fitting approach is applied, yielding a SPICE-compatible equivalent circuit representation of the power bus. The presented approaches allow us to embed the power planes as a linear N port into a circuit simulator, in order to perform a complete analysis of a power-bus system with active and passive components and the complete decoupling circuitry. The accuracy of the suggested method is validated by independent 3D-full wave simulations and experimental results.
Keywords :
SPICE; circuit simulation; integral equations; printed circuits; time-frequency analysis; 2D-integral equation approach; SPICE-compatible equivalent circuit; circuit simulator; linear N port; power-bus structure; printed-circuit boards; subsequent macromodeling step; time-and frequency domain; vector-fitting approach; Capacitors; Computer integrated manufacturing; Equations; Frequency response; Impedance; Integrated circuit modeling; Mathematical model;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location :
Fort Lauderdale, FL
ISSN :
2158-110X
Print_ISBN :
978-1-4244-6305-3
Type :
conf
DOI :
10.1109/ISEMC.2010.5711306
Filename :
5711306
Link To Document :
بازگشت