DocumentCode
2486434
Title
Efficient macromodeling of power-bus structures based on 2D-integral equation approach
Author
Leone, M. ; Kröning, O.
Author_Institution
Dept. of Theor. Electr. Eng., Otto-von-Guericke Univ. of Magdeburg, Magdeburg, Germany
fYear
2010
fDate
25-30 July 2010
Firstpage
390
Lastpage
395
Abstract
A numerically very efficient simulation method for the analysis of arbitrarily shaped power-bus structures on printed-circuit boards is presented. It is based on a 2D contour integral-equation method in combination with a subsequent macromodeling step, for simulation in time- and frequency domain. For this purpose a vector-fitting approach is applied, yielding a SPICE-compatible equivalent circuit representation of the power bus. The presented approaches allow us to embed the power planes as a linear N port into a circuit simulator, in order to perform a complete analysis of a power-bus system with active and passive components and the complete decoupling circuitry. The accuracy of the suggested method is validated by independent 3D-full wave simulations and experimental results.
Keywords
SPICE; circuit simulation; integral equations; printed circuits; time-frequency analysis; 2D-integral equation approach; SPICE-compatible equivalent circuit; circuit simulator; linear N port; power-bus structure; printed-circuit boards; subsequent macromodeling step; time-and frequency domain; vector-fitting approach; Capacitors; Computer integrated manufacturing; Equations; Frequency response; Impedance; Integrated circuit modeling; Mathematical model;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711306
Filename
5711306
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