DocumentCode
2486477
Title
Hybrid method used to model via transitions
Author
Wang, Hanfeng ; Ruehli, Albert E. ; Fan, Jun
Author_Institution
UMR/MST EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear
2010
fDate
25-30 July 2010
Firstpage
401
Lastpage
406
Abstract
A hybrid approach to solve via impedance and model via transitions is presented in the paper. The method is a combination of via-plane capacitance extraction and the impedance matrices calculation of parallel plane pair. A new formulation of the integral equation method for axially symmetric geometry is used for the capacitance extraction. The method is validated with other model results.
Keywords
capacitance; geometry; impedance matrix; integral equations; printed circuit design; axially symmetric geometry; hybrid method; impedance matrices calculation; integral equation method; parallel plane pair; via impedance; via transitions; via-plane capacitance extraction; Capacitance; Conductors; Geometry; Impedance; Integrated circuit modeling; Mathematical model; Transmission line matrix methods; capacitance calculations; hybrid method; physics-based circuit model; power plane impedance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711308
Filename
5711308
Link To Document