DocumentCode
2487322
Title
High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method
Author
Shao, Yang ; Peng, Zhen ; Lee, Jin-Fa
Author_Institution
Electro Sci. Lab., Ohio State Univ., Columbus, OH, USA
fYear
2010
fDate
25-30 July 2010
Firstpage
637
Lastpage
642
Abstract
A non-conformal domain decomposition method (DDM) is proposed to investigate signal integrity (SI) of high-speed interconnects on multi-scale, multi-layer printed circuit board (PCB) in this paper. The accuracy and robustness of the proposed method is first demonstrated by analysis of a 4-layer differential pair. Then we studied a 14-layer 16 traces interconnect model to demonstrate the efficiency of the method. Eye diagrams of the two models are studied for time domain SI.
Keywords
integrated circuit interconnections; printed circuits; high speed interconnects; multilayer PCB analysis; multilayer printed circuit board; nonconformal domain decomposition method; signal integrity; Analytical models; Convergence; Finite element methods; Geometry; Integrated circuit interconnections; Reflection; Scattering parameters; Domain decomposition method; Maxwell´s equations; Second order transmission conditions; Signal Integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711351
Filename
5711351
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