DocumentCode :
2487943
Title :
Delay fault testing: choosing between random SIC and random MIC test sequences
Author :
Virazel, A. ; David, R. ; Girard, P. ; Landrault, C. ; Pravossoudovitch, S.
Author_Institution :
Lab. d´´Inf. de Robotique et de Microelectron., Univ. des Sci. et Tech. du Languedoc, Montpellier, France
fYear :
2000
fDate :
2000
Firstpage :
9
Lastpage :
14
Abstract :
The combination of higher quality requirements and sensitivity of high performance circuits to delay defects has led to an increasing emphasis on delay testing of VLSI circuits. In this context, it has been proven that Single Input Change (SIC) test sequences are more effective than classical Multiple Input Change (MIC) test sequences when a high robust delay fault coverage is targeted In this paper, we show that random SIC (RSIC) test sequences achieve a higher fault coverage than random MIC (RMIC) test sequences when both robust and non-robust tests are under consideration. Experimental results given in this paper are based on a software generation of RSIC test sequences that can be easily generated in this case. For a built-in self-test (BIST) purpose, hardware generated RSIC sequences have to be used. This kind of generation is briefly discussed
Keywords :
VLSI; automatic test pattern generation; built-in self test; delays; fault simulation; integrated circuit testing; logic testing; RSIC test sequences; VLSI circuits; built-in self-test; delay fault testing; fault models; hardware generated RSIC sequences; high performance circuits; high robust delay fault coverage; multiple input change test sequences; random test sequences; single input change test sequences; software generation; Built-in self-test; Circuit faults; Circuit testing; Delay effects; Hardware; Microwave integrated circuits; Robustness; Silicon carbide; Software testing; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Test Workshop, 2000. Proceedings. IEEE European
Conference_Location :
Cascais
ISSN :
1530-1877
Print_ISBN :
0-7695-0701-8
Type :
conf
DOI :
10.1109/ETW.2000.873772
Filename :
873772
Link To Document :
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