DocumentCode
2487995
Title
Surface impedance approach to calculate loss in rough conductor coated with dielectric layer
Author
Koledintseva, Marina ; Koul, Amendra ; Zhou, Fan ; Drewniak, James ; Hinaga, Scott
Author_Institution
Center for Electromagn. Compatibility, Missouri Univ. of Sci. & Technol. (MS&T), Rolla, MO, USA
fYear
2010
fDate
25-30 July 2010
Firstpage
790
Lastpage
795
Abstract
The analysis presented herein contains closed-form analytical expressions to calculate attenuation in a layered structure “rough metal-dielectric-dielectric”, which is a practically important problem in separating dielectric loss from rough conductor loss in actual PCB stripline geometries, when measuring dielectric constant (Dk) and dissipation factor (Df) using travelling wave S-parameter methods. This approach is based on the surface impedance concept. It is shown that the presence of an epoxy layer on the conductor may affect extracted dielectric parameters, of a PCB substrate, especially the Df data.
Keywords
S-parameters; dielectric losses; permittivity; printed circuit design; surface impedance; PCB stripline geometries; dielectric constant; dielectric layer; dielectric loss; dissipation factor; epoxy layer; rough conductor; rough metal-dielectric-dielectric structure; surface impedance; travelling wave S-parameter method; Conductors; Corrugated surfaces; Dielectrics; Impedance; Surface impedance; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711380
Filename
5711380
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