• DocumentCode
    2487995
  • Title

    Surface impedance approach to calculate loss in rough conductor coated with dielectric layer

  • Author

    Koledintseva, Marina ; Koul, Amendra ; Zhou, Fan ; Drewniak, James ; Hinaga, Scott

  • Author_Institution
    Center for Electromagn. Compatibility, Missouri Univ. of Sci. & Technol. (MS&T), Rolla, MO, USA
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    790
  • Lastpage
    795
  • Abstract
    The analysis presented herein contains closed-form analytical expressions to calculate attenuation in a layered structure “rough metal-dielectric-dielectric”, which is a practically important problem in separating dielectric loss from rough conductor loss in actual PCB stripline geometries, when measuring dielectric constant (Dk) and dissipation factor (Df) using travelling wave S-parameter methods. This approach is based on the surface impedance concept. It is shown that the presence of an epoxy layer on the conductor may affect extracted dielectric parameters, of a PCB substrate, especially the Df data.
  • Keywords
    S-parameters; dielectric losses; permittivity; printed circuit design; surface impedance; PCB stripline geometries; dielectric constant; dielectric layer; dielectric loss; dissipation factor; epoxy layer; rough conductor; rough metal-dielectric-dielectric structure; surface impedance; travelling wave S-parameter method; Conductors; Corrugated surfaces; Dielectrics; Impedance; Surface impedance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
  • Conference_Location
    Fort Lauderdale, FL
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4244-6305-3
  • Type

    conf

  • DOI
    10.1109/ISEMC.2010.5711380
  • Filename
    5711380