Title :
Hierarchical defect-oriented fault simulation for digital circuits
Author :
Blyzniuk, M. ; Cibaková, T. ; Gramatová, E. ; Kuzmicz, W. ; Lobur, M. ; Pleskacz, W. ; Raik, J. ; Ubar, R.
Author_Institution :
State Univ. Lvivska Politechnika, Poland
Abstract :
A new fault model is developed for estimating the coverage of physical defects in digital circuits for given test sets. Based on this model, a new hierarchical defect oriented fault simulation method is proposed. At the higher level simulation we use the functional fault model, at the lower level we use the defect/fault relationships in the form of defect coverage table and the defect probabilities. A description and the experimental data are given about probabilistic analysis of a complex CMOS gate. Analysis of the quality of 100% stuck-at fault test sets for two benchmark circuits in covering physical defects like internal shorts, stuck-opens and stuck-ons. It has been shown that in the worst case a test with 100% stuck-at fault coverage may, have only 50% coverage for internal shorts in complex CMOS gates. It has been shown that classical test coverage calculation based on counting defects without taking into account the defect probabilities may lead to considerable overestimation of results
Keywords :
CMOS logic circuits; automatic test pattern generation; fault simulation; integrated circuit testing; logic testing; benchmark circuits; complex CMOS gate; counting defects; defect coverage table; defect probabilities; defect/fault relationships; digital circuits; fault model; functional fault; hierarchical defect oriented fault simulation; higher level simulation; internal shorts; library cells; stuck-at fault test sets; stuck-ons; stuck-opens; CMOS integrated circuits; CMOS technology; Circuit faults; Circuit simulation; Circuit testing; Digital circuits; Integrated circuit modeling; Semiconductor device modeling; System testing; Very large scale integration;
Conference_Titel :
Test Workshop, 2000. Proceedings. IEEE European
Conference_Location :
Cascais
Print_ISBN :
0-7695-0701-8
DOI :
10.1109/ETW.2000.873781