• DocumentCode
    248887
  • Title

    Generic segment-wise DC for 3D-HEVC depth intra coding

  • Author

    Hongbin Liu ; Ying Chen

  • Author_Institution
    Qualcomm Technol. Inc., San Diego, CA, USA
  • fYear
    2014
  • fDate
    27-30 Oct. 2014
  • Firstpage
    3219
  • Lastpage
    3222
  • Abstract
    In 3D extension of HEVC (High Efficiency Video Coding), namely, 3D-HEVC, segment-wise DC coding (SDC) was adopted to more efficiently represent the depth residual for Intra coded depth blocks. Instead of coding pixel-wise residual as in HEVC, SDC codes one DC residual value for each segment of a Prediction Unit (PU) and skips transform and quantization. SDC was originally proposed for only a couple of modes, including the DC mode, Planar mode and depth modeling mode (DMM), which has an arbitrary straight line separation of a PU. This paper proposes a generic SDC method that applies to the conventional angular Intra modes. For each depth prediction unit coded with Intra prediction mode, encoder can adaptively choose to code pixel-wise residual or segment-wise residual to achieve better compression efficiency. Experimental results show that proposed method can reduce the total bit rate by about 1% even though the depth views altogether consumes relatively low percentage of the total bit rate.
  • Keywords
    data compression; video coding; 3D-HEVC depth intra coding; DC residual value; DMM; PU; SDC codes; angular intra modes; depth modeling mode; depth prediction unit; depth residual; encoder; generic segment-wise DC coding; high efficiency video coding; intra coded depth blocks; intra prediction mode; pixel-wise residual coding; planar mode; segment-wise residual; Collaboration; Decoding; Encoding; Indexes; Joints; Three-dimensional displays; Video coding; 3D video coding; 3D-HEVC; SDC; depth Intra prediction mode; segment-wise DC coding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Image Processing (ICIP), 2014 IEEE International Conference on
  • Conference_Location
    Paris
  • Type

    conf

  • DOI
    10.1109/ICIP.2014.7025651
  • Filename
    7025651