Title :
GFAP inflammatory response to dextran-coated silicon electrodes
Author :
Holecko, Matthew M., II ; Massia, Stephen P.
Author_Institution :
Dept. of Bioeng., Arizona State Univ., Tempe, AZ, USA
Abstract :
Recent advances in three-dimensional, confocal imaging techniques and image analysis software allow for previously unattainable measurements in the neural environment. Specifically, relative quantitative measurements of the amount of glial fibrillary acidic protein (GFAP) surrounding a neural implant can be determined. In this study, dextran coatings have been applied to silicon neural implants. Dextran coatings have been shown to limit non-specific cell adhesion in vitro. Thus, it is believed that these coatings will limit the amount of gliosis surrounding a neural implant and ultimately improve signal-to-noise ratio. To test this hypothesis, Sprague-Dawley rats were implanted with both dextran-coated and non-dextran-coated silicon electrodes. Using immunohistochemical staining in conjunction with confocal imaging and image analysis techniques, the differences in GFAP upregulation between dextran-coated and non-treated silicon neural implants were investigated.
Keywords :
adhesion; biological techniques; biomedical electrodes; cellular biophysics; neurophysiology; optical microscopy; proteins; silicon; GFAP inflammatory response; Si; Sprague-Dawley rats; dextran-coated silicon electrodes; glial fibrillary acidic protein; image analysis software; neural environment; neural implant; nonspecific cell adhesion limitation; relative quantitative measurements; signal-to-noise ratio improvement; three-dimensional confocal imaging techniques; Adhesives; Coatings; Electrodes; Image analysis; Implants; In vitro; Proteins; Signal to noise ratio; Silicon; Software measurement;
Conference_Titel :
Engineering in Medicine and Biology, 2002. 24th Annual Conference and the Annual Fall Meeting of the Biomedical Engineering Society EMBS/BMES Conference, 2002. Proceedings of the Second Joint
Print_ISBN :
0-7803-7612-9
DOI :
10.1109/IEMBS.2002.1053049