• DocumentCode
    2491497
  • Title

    Study on Crystal Breakage Mechanism in Bulk InxGa1-xAs Grown by Two-Step MCZM Method

  • Author

    Rahman, M.S. ; Islam, Md Rafiqul ; Alam, Md Shamsul ; Bhuiyan, A.G. ; Yamada, M.

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Khulna Univ. of Eng. & Technol.
  • fYear
    2006
  • fDate
    19-21 Dec. 2006
  • Firstpage
    382
  • Lastpage
    385
  • Abstract
    An analytical study has been carried out for understanding the breakage mechanism in bulk InxGa1- xAs crystal grown by the two-step multi-component zone melting (MCZM) method. It was confirmed from Raman scattering and energy dispersive X-ray experiments that large amount of strain was induced by the compositional variation in bulk InxGa1-xAs. It was anticipated that this large amount of strain could be the main cause of the cracks observed on the cut surface of the InxGa1- xAs crystal. In order to understand the crystal breakage mechanism clearly, the quantitative amount of strains and their distributions were evaluated using an axially symmetrical strain model for the existing-like compositional profile. It was found that the strains were increased gradually during the first step and then decreased drastically at the end of this step. This drastic changing behavior of strains could be the main cause of the breakage in the bulk InxGa1 - xAs crystals grown by the two-step MCZM growth process
  • Keywords
    Raman spectra; X-ray chemical analysis; gallium arsenide; indium compounds; surface cracks; zone melting; InGaAs; Raman scattering; axially symmetrical strain model; compositional profile; compositional variation; crystal breakage mechanism; crystal growth; energy dispersive X-ray analysis; multicomponent zone melting; strains distributions; Capacitive sensors; Crystalline materials; Crystals; Diode lasers; Dispersion; Gallium arsenide; Phonons; Raman scattering; Strain measurement; Surface cracks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical and Computer Engineering, 2006. ICECE '06. International Conference on
  • Conference_Location
    Dhaka
  • Print_ISBN
    98432-3814-1
  • Type

    conf

  • DOI
    10.1109/ICECE.2006.355651
  • Filename
    4178487