DocumentCode
2491734
Title
Mutual thermal effects of light-emitting diode with wafer-level packages
Author
Choi, Jae-Wan ; Kang, Jeung-Mo ; Kim, Jae-Wook ; Choi, Jeong-Hyeon ; Kim, Du-Hyun ; Kim, Geun-Ho ; Lee, Jeong-Soo
Author_Institution
LG Electron. Inst. of Technol., Seoul
fYear
2007
fDate
17-19 Oct. 2007
Firstpage
357
Lastpage
359
Abstract
Wafer-level packaged LEDs are useful for the high power applications such as back light unit (BLU) and general solid state lighting due to the compactness and integrated fabrication process with Si-MEMS technology. In this paper, thermal characteristics of wafer-level packaged LEDs with four multi-chips are investigated including mutual thermal effects due to the adjacent chips using both serial and parallel measurement methods.
Keywords
light emitting diodes; optical fabrication; wafer level packaging; light-emitting diode; mutual thermal effects; solid state lighting; wafer-level packages; Costs; Electronic packaging thermal management; Etching; Geometrical optics; Light emitting diodes; Optical device fabrication; Semiconductor device measurement; Temperature; Thermal resistance; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication and Optoelectronics Conference, 2007 Asia
Conference_Location
Shanghai
Print_ISBN
978-0-9789217-2-9
Electronic_ISBN
978-0-9789217-2-9
Type
conf
DOI
10.1109/AOE.2007.4410806
Filename
4410806
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