CPW MMIC power amplifier design for flip-chip packaged power amplifiers

Author

Wong, Alex ; McAdoo, Kyle ; Linton, David

Author_Institution

Dept. of Electr. & Electron. Eng., Queen´´s Univ., Belfast, UK

fYear

2000

fDate

2000

Firstpage

32

Lastpage

37

Abstract

There has been considerable interest in and development of MMIC power amplifiers for sub-miniature packaging using flip chip technology combined with CPW layout technologies. A new approach is developed to synthesis both the input/output power combining and impedance matching in a coplanar waveguide (CPW) MMIC power amplifier at 14 GHz. We then compare at selected band frequencies the output power gain and stability with those measured for a fabricated MMIC device of well known properties in order to validate the problem presented. Performance characteristics of this MMIC amplifier are compared with those of an identical simulated structure having an air bridged CPW realization

Keywords

HEMT integrated circuits; MMIC power amplifiers; circuit stability; coplanar waveguides; field effect MMIC; flip-chip devices; impedance matching; integrated circuit design; integrated circuit metallisation; integrated circuit packaging; power combiners; 14 GHz; CPW MMIC power amplifier design; CPW layout technologies; PHEMT devices; SHF; coplanar waveguide; flip-chip packaged power amplifiers; impedance matching; input/output power combining; output power gain; performance characteristics; stability; sub-miniature packaging; Coplanar waveguides; Flip chip; Frequency; Impedance matching; MMICs; Packaging; Power amplifiers; Power generation; Power measurement; Stability;

fLanguage

English

Publisher

ieee

Conference_Titel

High Frequency Postgraduate Student Colloquium, 2000

Conference_Location

Dublin

Print_ISBN

0-7803-6590-9

Type

conf

DOI

10.1109/HFPSC.2000.874078

Filename

874078