DocumentCode
2492722
Title
The O-Sequence: Representation of 3D-Floorplan Dissected by Rectangular Walls
Author
Ohta, Hidenori ; Yamada, Tomoaki ; Kodama, Chikaaki ; Fujiyoshi, Kunihiro
Author_Institution
Dept. of Electron. & Inf. Eng., Tokyo Univ. of Agric. & Technol.
fYear
0
fDate
0-0 0
Firstpage
317
Lastpage
320
Abstract
A 3D-floorplan of a rectangular solid is a dissection of the rectangular solid into smaller rectangular solids by planes, and can be used as a floorplan of a 3D VLSI. It is known that any 3D-floorplan restricted to a slicing structure can be coded by a slicing tree. However, no method of expressing any 3D-floorplan is known. In this paper, we propose an O-sequence, a string of representing any 3D-floorplan dissected by only non-crossing rectangular planes. We also present a necessary and sufficient condition for a given string to be an O-sequence
Keywords
VLSI; integrated circuit layout; 3D VLSI; 3D-floorplan; O-sequence; noncrossing rectangular planes; rectangular solid; rectangular walls; slicing tree; Agricultural engineering; Agriculture; Informatics; Mathematics; Semiconductor device packaging; Simulated annealing; Solids; Sufficient conditions; Very large scale integration; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Research in Microelectronics and Electronics 2006, Ph. D.
Conference_Location
Otranto
Print_ISBN
1-4244-0157-7
Type
conf
DOI
10.1109/RME.2006.1689960
Filename
1689960
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