DocumentCode :
2492886
Title :
Surface modification of SU-8 by photografting of functional polymers for lab-on-a-chip applications
Author :
Gao, Zhan ; Henthorn, David B. ; Kim, Chang-Soo
Author_Institution :
Univ. of Missouri-Rolla, Rolla
fYear :
2006
fDate :
22-25 Oct. 2006
Firstpage :
121
Lastpage :
123
Abstract :
Due to the high flexibility and versatility in the process development of microfluidic devices, an epoxy-based, high-aspect ratio photoresist SU-8 is now attracting attention as the main structuring material of the fluidic channels. Manipulation of the surface properties of SU-8 channel wall is critical to attach functional films such as enzyme-immobilized layers or biocompatible layers. We describe a new in situ patterning method to form a hydrogel film on SU-8 by a photografted polymerization procedure. The hydrophobic surface of SU-8 is modified using a surface bound initiator HCPK (1-hydroxycyclohexyl phenyl ketone). A p-HEMA (poly-2-hydroxyethylmethacrylate) hydrogel film is grafted by photopolymerization of solution-phase precursors on the modified surface. The contact angle measurements reveal that the hydrophilicity was increased after the grafting. This is a promising in situ formation method of patterned functional films within a completed microfluidic channel.
Keywords :
bioMEMS; lab-on-a-chip; microfluidics; photoresists; polymer blends; polymer films; polymerisation; surface treatment; 1-hydroxycyclohexyl phenyl ketone; HCPK; contact angle measurements; fluidic channels; functional polymers; hydrogel film; hydrophobic surface; in situ formation; in situ patterning; lab-on-a-chip; microfluidic channel; microfluidic devices; p-HEMA (poly-2-hydroxyethylmethacrylate); photografted polymerization; photografting; photopolymerization; photoresist SU-8; process development; structuring material; surface bound initiator; surface modification; surface properties manipulation; Biological materials; Biology; Chemical and biological sensors; Chemistry; Lab-on-a-chip; Microfluidics; Polymer films; Resists; Surface treatment; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Sensors, 2006. 5th IEEE Conference on
Conference_Location :
Daegu
ISSN :
1930-0395
Print_ISBN :
1-4244-0375-8
Electronic_ISBN :
1930-0395
Type :
conf
DOI :
10.1109/ICSENS.2007.355733
Filename :
4178571
Link To Document :
بازگشت