Integration of SAW filter on PICS substrate using polymer sealing

Author

Georgel, V. ; Verjus, F. ; van Grunsven, E.C.E. ; Poulichet, P. ; Chamaly, G.S.

Author_Institution

Philips Semicond.

fYear

0

fDate

0-0 0

Firstpage

421

Lastpage

424

Abstract

This paper presents a technique to integrate a die containing an electro-mechanical component on a passive integration connecting substrate (PICS) using a polymer-sealing ring. The active die is also used as a capping substrate and the polymer ring acts as a bonding and sealing material. Two polymers are tested, the Benzocyclobutene (BCB) and the SU-8. The fabrication process is described and packages are characterized in terms of mechanical strength. A finite element model was used to simulate the behavior of the heterogeneous flip-chip package when submitted to thermal and mechanical loads

Keywords

finite element analysis; flip-chip devices; materials testing; sealing materials; surface acoustic wave filters; PICS substrate; SAW filter; SU-8; benzocyclobutene; electromechanical component; finite element model; flip chip package; mechanical loads; mechanical strength; polymer sealing; thermal loads; Bonding; Fabrication; Finite element methods; Joining processes; Packaging; Polymers; SAW filters; Sealing materials; Testing; Thermal loading;

fLanguage

English

Publisher

ieee

Conference_Titel

Research in Microelectronics and Electronics 2006, Ph. D.

Conference_Location

Otranto

Print_ISBN

1-4244-0157-7

Type

conf

DOI

10.1109/RME.2006.1689984

Filename

1689984