DocumentCode :
2493948
Title :
Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium
fYear :
1996
fDate :
14-16 Oct. 1996
Abstract :
The following topics were dealt with: flip-chip developments; semiconductor manufacturing cycle time; packaging; integrated design and manufacture; cost modelling; high density substrates; environmentally-conscious manufacturing; assembly and reliability; manufacturing management; process modelling; process quality; and process control
Keywords :
assembling; environmental factors; flip-chip devices; integrated circuit design; integrated circuit manufacture; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; process control; quality control; semiconductor process modelling; assembly; cost modelling; environmentally-conscious manufacturing; flip-chip developments; high density substrates; integrated design/manufacture; manufacturing management; packaging; process control; process modelling; process quality; reliability; semiconductor manufacturing cycle time;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX, USA
ISSN :
1089-8190
Print_ISBN :
0-7803-3642-9
Type :
conf
DOI :
10.1109/IEMT.1996.559673
Filename :
559673
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2493948
بازگشت