Abstract :
The following topics are dealt with: thermal modelling; integrated circuit modelling; 3D chip architectures; integrated circuit design; thermal measurement; advanced cooling techniques; and thermal interface materials.
Keywords :
cooling; integrated circuit design; integrated circuit modelling; thermal analysis; 3D chip architectures; advanced cooling techniques; integrated circuit design; integrated circuit modelling; thermal interface materials; thermal measurement; thermal modelling;
Conference_Titel :
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
Conference_Location :
Leuven
Print_ISBN :
978-1-4244-5881-3
