Title :
Flexible Tactile Sensor Fabricated using Polymer Membrane
Author :
Cho, Woo-Sung ; Kim, Kunnyun ; Lee, Kang Ryeol ; Kim, Yong-Kook ; Lee, Dae-Sung ; Kim, Won Hyo ; Cho, Nam-Kyu ; Park, Kwang-Bum ; Park, Hyo-Derk ; Park, Jung-Ho ; Ju, Byeong-Kwon
Author_Institution :
Korea Univ., Seoul
Abstract :
We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.
Keywords :
electronics packaging; membranes; micromachining; microsensors; polymer films; printed circuits; strain gauges; tactile sensors; fabrication process; flexible printed circuit board; flexible tactile sensor; metal strain gauge; packaging technologies; polymer membrane; polymer processing; shear force; silicon micromachining; Biomembranes; Fabrication; Flexible printed circuits; Force sensors; Micromachining; Packaging; Polymers; Sensor phenomena and characterization; Silicon; Tactile sensors;
Conference_Titel :
Sensors, 2006. 5th IEEE Conference on
Conference_Location :
Daegu
Print_ISBN :
1-4244-0375-8
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2007.355572