Flexible Tactile Sensor Fabricated using Polymer Membrane

Author

Cho, Woo-Sung ; Kim, Kunnyun ; Lee, Kang Ryeol ; Kim, Yong-Kook ; Lee, Dae-Sung ; Kim, Won Hyo ; Cho, Nam-Kyu ; Park, Kwang-Bum ; Park, Hyo-Derk ; Park, Jung-Ho ; Ju, Byeong-Kwon

Author_Institution

Korea Univ., Seoul

fYear

2006

fDate

22-25 Oct. 2006

Firstpage

730

Lastpage

733

Abstract

We present the fabrication process and the characteristics of a flexible tactile sensor by silicon micromachining, polymer processing and packaging technologies. The fabrication process for the tactile sensor was composed of in the fabrication of sensor chips and their packaging on the flexible printed circuit board (FPCB). The variation rate of resistance was about 4.6%/N when normal force was applied. This sensor can be used to sense touch, pressure, and slip because the signals are is are determined by the variations of resistance of the metal strain gauge for normal and shear force in tactile sensor.

Keywords

electronics packaging; membranes; micromachining; microsensors; polymer films; printed circuits; strain gauges; tactile sensors; fabrication process; flexible printed circuit board; flexible tactile sensor; metal strain gauge; packaging technologies; polymer membrane; polymer processing; shear force; silicon micromachining; Biomembranes; Fabrication; Flexible printed circuits; Force sensors; Micromachining; Packaging; Polymers; Sensor phenomena and characterization; Silicon; Tactile sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2006. 5th IEEE Conference on

Conference_Location

Daegu

ISSN

1930-0395

Print_ISBN

1-4244-0375-8

Electronic_ISBN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2007.355572

Filename

4178724