DocumentCode
2495547
Title
[Front cover]
fYear
2008
fDate
1-2 Dec. 2008
Abstract
The following topics were dealt with: advanced packaging; thermal design; mechanical design; signal and power integrity; flip chip and interconnection; advanced material; embedded device; integrated passive device; and 3-D packaging.
Keywords
VLSI; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; 3-D packaging; embedded device; flip chip technology; integrated passive device; interconnection; mechanical design; thermal design;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location
Kyoto
Print_ISBN
978-1-4244-3498-5
Type
conf
DOI
10.1109/VPWJ.2008.4762179
Filename
4762179
Link To Document