Title :
Development of SPICE Compatible Thermal Model of Silicon MEMS Piezoresistive Pressure Sensor for CMOS-MEMS Integration
Author :
Pramanik, C. ; Banerjee, S. ; Mukherjee, D. ; Saha, H.
Author_Institution :
Bengal Eng. & Sci. Univ. Shibpur, Howrah
Abstract :
In this paper, the effects of electrical heating in a silicon MEMS piezoresistive pressure sensor have been analyzed analytically and verified experimentally with a view to design energy efficient sensor node network where the sensors are operated for a prolonged time. For the integration of the MEMS sensor with the CMOS circuits, a SPICE compatible thermal equivalent circuit has been developed for the purpose, which imports the values of thermal resistance, time constant, and thermal capacitance by a dynamically linked library from the external user defined model.
Keywords :
CMOS integrated circuits; SPICE; electric heating; equivalent circuits; microsensors; piezoresistive devices; pressure sensors; silicon; CMOS-MEMS integration; SPICE compatible thermal model; Si; electrical heating; silicon MEMS piezoresistive pressure sensor; thermal equivalent circuit; Capacitive sensors; Circuits; Energy efficiency; Micromechanical devices; Piezoresistance; Resistance heating; SPICE; Silicon; Thermal resistance; Thermal sensors;
Conference_Titel :
Sensors, 2006. 5th IEEE Conference on
Conference_Location :
Daegu
Print_ISBN :
1-4244-0375-8
Electronic_ISBN :
1930-0395
DOI :
10.1109/ICSENS.2007.355580
