Prediction of board level reliability of drop test for system-in-package

The drop reliability of mobile electronic products has become a major concern recently. Especially, system-in-package (SIP) like stacked-die-package and package-on-package may lead to increased the stress during drop impact due to their complicate structure. In this study, evaluation and prediction of the drop reliability for SIP was performed using modeling techniques. 3D-dynamic nonlinear finite element analysis was conducted for simulation of drop test, and a good correlation was observed between the simulation result and actual drop test. The optimization for material properties of the package was also studied using the correlation data and modeling.