Title :
High reliability planar InGaAs avalanche photodiodes
Author :
Kobayashi, M. ; Shirai, T. ; Kaneda, T.
Author_Institution :
Fujitsu Ltd., Kawasaki, Japan
Abstract :
The reliability of planar buried-structure InGaAs APDs (avalanche photodiodes) for long-wavelength optical transmission systems was investigated. High-temperature aging tests were performed at 150 degrees C, 175 degrees C, and 200 degrees C, and two distinctive failure distributions (early failure and wear-out failure) were observed. The early failure is predicted to be caused by microplasma at the periphery of the guard ring junction, and the wear-out failure is related to the InP/SiN/sub x/ interface degradation by hot hole injection. The activation energy of the wear-out failure is estimated to be 1.15 eV, and the extrapolated median life at 50 degrees C exceeds 10/sup 8/ h. In the second step of the life testing, burn-in screening at 200 degrees C was shown to be effective in removing early failure and achieving long-term stability. 750000 h of device operation has been achieved without any failure at test temperatures of 125 degrees C and 150 degrees C, which indicates high reliability of the APDs.<>
Keywords :
III-V semiconductors; ageing; avalanche photodiodes; environmental testing; failure analysis; gallium arsenide; indium compounds; inspection; life testing; optical communication equipment; reliability; 1.15 eV; 125 to 200 C; 1E8 h; 50 C; 750000 h; APDs; InGaAs; InP-SiN/sub x/; activation energy; aging tests; avalanche photodiodes; burn-in screening; early failure; failure distributions; guard ring junction; high reliability; high temperature life testing; hot hole injection; life testing; long-term stability; long-wavelength optical transmission systems; microplasma; planar buried-structure; semiconductors; wear-out failure; Aging; Avalanche photodiodes; Degradation; Hot carriers; Indium gallium arsenide; Indium phosphide; Life estimation; Life testing; Performance evaluation; Silicon compounds;
Conference_Titel :
Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
Conference_Location :
Washington, DC, USA
Print_ISBN :
0-7803-0817-4
DOI :
10.1109/IEDM.1989.74158