• DocumentCode
    2496247
  • Title

    Session 5 Flip chip and interconnection

  • Author

    Hirofumi Nakajima ; Tomoshi Ohde

  • Author_Institution
    NEC Electronics Corp., Japan
  • fYear
    2008
  • fDate
    1-2 Dec. 2008
  • Firstpage
    85
  • Lastpage
    85
  • Abstract
    Start of the above-titled section of the conference proceedings record.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4244-3498-5
  • Type

    conf

  • DOI
    10.1109/VPWJ.2008.4762214
  • Filename
    4762214
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2496247