fDate :
Aug. 30 2009-Sept. 4 2009
Abstract :
The following topics are dealt with: EOS/ESD/EMC; on-chip protection; CMOS analog, digital latch-up; TLP/HBM/MM/CDM component testing; numerical simulation and modelling, reliability; extremely sensitive devices; MR-heads; MEMS and system level testing.
Keywords :
CMOS integrated circuits; electromagnetic compatibility; electrostatic discharge; flip-flops; micromechanical devices; system-on-chip; CMOS analog latch-up; EMC; ESD; MEMS; component testing; digital latch-up; on-chip protection; reliability; system level testing;
Conference_Titel :
EOS/ESD Symposium, 2009 31st
Conference_Location :
Anaheim, CA
Print_ISBN :
978-1-58537-176-1
