New developments in flip chip

Flip chip interconnect has been adopted for a variety of applications. Drivers for adoption continue to be performance and form factor. Flip chip interconnect is expanding into many device types ranging from high performance logic to a variety of LSIs found in wireless products. Some form of bump connection is also used for chip-to-wafer or wafer-to-wafer connections in through silicon via (TSV) technology or chip-to-chip interconnection. This interconnect technology is increasingly referred to as a micro bump. This presentation examines the new developments in flip chip interconnect, including various types of bumps such as solder (both Pb-free and conventional) copper pillar, stud bumps, and micro bumps. Pitch trends and the impact on substrate design rules are also examined. Both laminate and silicon substrates are discussed.