Title :
High temperature deformation of high density interconnects and packages by moire interferometry/FEM hybrid method
Author :
Zhu, Jiansen ; Zou, Daqing ; Dai, Fulong ; Liu, Sheng ; Guo, Yi-Fan
Author_Institution :
Dept. of Mech. Eng., Wayne State Univ., Detroit, MI, USA
Abstract :
In the current study, 1200 I/mm grating or 600 1/mm gratings are replicated at either 80°C or 160°C onto the cross sections of several high density area interconnects and packages. These packages include BGA, flip-chip, and glob-top packages. The specimens are measured at room temperature for the thermal deformation induced by the cooling process. The strain distributions inside the solder joints are analyzed by both the moire interferometry and experimental/FEM hybrid method. Warpage of the packaging systems was measured and the effects of the bonding, encapsulation, soldering, and geometry on the deformation are discussed
Keywords :
cooling; deformation; displacement measurement; encapsulation; finite element analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; light interferometry; moire fringes; soldering; 160 C; 80 C; BGA packages; bonding effects; cooling process; encapsulation effects; experimental/FEM hybrid method; flip-chip packages; glob-top packages; gratings; high density interconnects; high density packages; high temperature deformation; moire interferometry; solder joints; strain distributions; thermal deformation; warpage; Bonding; Capacitive sensors; Cooling; Encapsulation; Geometry; Gratings; Interferometry; Packaging; Soldering; Temperature measurement;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-3642-9
DOI :
10.1109/IEMT.1996.559686
