• DocumentCode
    2496903
  • Title

    A Monolithic Multi-sensor for three-axis Acccelerometer, Absolute pressure and Temperature

  • Author

    Jingbo, Xu ; Yulong, Zhao ; Zhuangde, Jiang ; Jian, Sun

  • Author_Institution
    Xi´´an Jiaotong Univ., Xi´´an
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    1049
  • Lastpage
    1052
  • Abstract
    A monolithic multi-sensor for use in the severe environments is presented in the paper. This monolithic multi-sensor is realized by using (100) SOI wafer, which consists of a three-axis piezoresistive accelerometer, a piezoresistive absolute pressure sensor and a silicon thermistor temperature sensor. The three-axis accelerometer has been designed with four silicon beams to support the mass. The appropriate piezoresistor arrangement in four beams can detect three-axis acceleration and eliminate cross-axis sensitivities. The pressure sensor consists of silicon membrane with four piezoresistors and vacuum chamber between silicon membrane and pyrex glass substrate. In order to minimize the effect of stress on temperature sensor, the thermistor made of boron ion-implanted is along [100] and [010] crystal orientation. The multi-sensor chip is fabricated by using bulk-micromachining technology and silicon-on-glass anodic bonding technology. The die size of the chip is 4times6times0.9 mm3. Measure results show the performance of the multi-sensor.
  • Keywords
    accelerometers; pressure sensors; sensor fusion; silicon-on-insulator; temperature sensors; thermistors; SOI wafer; absolute temperature; anodic bonding; boron ion-implantation; bulk-micromachining; crystal orientation; monolithic multisensor; piezoresistive absolute pressure sensor; piezoresistive accelerometer; pyrex glass substrate; silicon thermistor; temperature sensor; three-axis accelerometer; vacuum chamber; Acceleration; Accelerometers; Biomembranes; Glass; Particle beams; Piezoresistance; Silicon; Temperature sensors; Thermal sensors; Thermistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355805
  • Filename
    4178800