• DocumentCode
    2497269
  • Title

    Microanalysis of inhomogeneous reaction and Schottky-barrier change of Al/n-InP contacts upon rapid thermal annealing

  • Author

    Lin, T.-C. ; Kaibe, H.T. ; Kaneshiro, C. ; Miyazaki, S. ; Okumura, T.

  • Author_Institution
    Tokyo Metropolitan Univ., Hachioji, Tokyo, Japan
  • fYear
    1993
  • fDate
    19-22 Apr 1993
  • Firstpage
    691
  • Lastpage
    694
  • Abstract
    Although metal contacts to oxidized n-InP show relatively high Schottky-barrier height, they will not be stable upon thermal annealing since the interfacial reaction might dissociate the oxides. The authors present the change in electrical properties of Al/n-InP contacts upon the rapid thermal annealing in relation to the interfacial reaction. In a certain range of the annealing temperature, a rectifying contact was obtained with a high Schottky-barrier height close to 0.7 eV, for which compositional and electrical microanalysis were carried out by means of the electron-probe microanalysis and the scanning internal-photoemission microscopy. The results are discussed
  • Keywords
    III-V semiconductors; Schottky barriers; Schottky diodes; aluminium; electron probe analysis; indium compounds; photoemission; rapid thermal annealing; semiconductor-metal boundaries; surface chemistry; Al/n-InP contacts; Schottky-barrier change; annealing temperature; electrical properties; electron-probe microanalysis; inhomogeneous reaction; interfacial reaction; metal contacts; microanalysis; rapid thermal annealing; rectifying contact; scanning internal-photoemission microscopy; Artificial intelligence; Contacts; Indium phosphide; Microscopy; Optoelectronic devices; Rapid thermal annealing; Substrates; Temperature distribution; Thermal engineering; X-ray diffraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1993. Conference Proceedings., Fifth International Conference on
  • Conference_Location
    Paris
  • Print_ISBN
    0-7803-0993-6
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1993.380550
  • Filename
    380550