Wafer-Level Measurement of Thermal Conductivity on Thin Films

Author

Roncaglia, Alberto ; Mancarella, Fulvio ; Sanmartin, Michele ; Elmi, Ivan ; Cardinali, Gian Carlo ; Severi, Maurizio

Author_Institution

Inst. of Microelectron. & Microsyst. (IMM), Bologna

fYear

2006

fDate

22-25 Oct. 2006

Firstpage

1239

Lastpage

1242

Abstract

A method suited to perform wafer-level measurements of thermal conductivity on thin films by exploiting micromachined test structures is proposed. To this purpose, a measurement procedure able to compensate for instrumental offsets and sensitivity limits typically existing in a standard wafer-level electrical instrumentation, and to eliminate the influence of heat exchange through air is applied. In order to validate the technique, measurements on different thin films of interest in thermal MEMS fabrication are presented (LPCVD polycrystalline silicon, evaporated aluminum, LPCVD silicon oxide).

Keywords

integrated circuit testing; micromechanical devices; thermal conductivity measurement; thin film devices; LPCVD polycrystalline silicon; LPCVD silicon oxide; electrical instrumentation; evaporated aluminum; micromachined test structures; thermal MEMS fabrication; thermal conductivity; thin films; wafer-level measurement; Conductivity measurement; Electric variables measurement; Instruments; Measurement standards; Performance evaluation; Resistance heating; Silicon; Testing; Thermal conductivity; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Sensors, 2006. 5th IEEE Conference on

Conference_Location

Daegu

ISSN

1930-0395

Print_ISBN

1-4244-0375-8

Electronic_ISBN

1930-0395

Type

conf

DOI

10.1109/ICSENS.2007.355852

Filename

4178847