DocumentCode
2497955
Title
New Manufacturing Method For Capacitive Ultrasonic Transducers With Monocrystalline Membrane
Author
Rey, P. ; Salhi, M. ; Giroud, S. ; Lagahe-Blanchard, C. ; Clatot, S. ; Ballandras, S. ; Robert, P.
Author_Institution
CEA-LETI, Grenoble
fYear
2006
fDate
22-25 Oct. 2006
Firstpage
1293
Lastpage
1296
Abstract
A new method to manufacture capacitive micromachined ultrasonic transducers (cMUT) combining a wafer bonding and a sacrificial layer processes is introduced. Devices with monocrystalline silicon membranes over a polysilicon electrode have been manufactured. From impedance measurements in air of a monocell test device biased under 140 V, a resonance at 8.0 MHz and an electromechanical coupling coefficient of 45% have been found. Underwater pulse-echo experiments of a cell array are presented.
Keywords
capacitive sensors; micromachining; ultrasonic transducers; wafer bonding; capacitive ultrasonic transducers; electromechanical coupling coefficient; frequency 8.0 MHz; impedance measurements; manufacturing method; monocrystalline silicon membranes; polysilicon electrode; sacrificial layer processes; voltage 140 V; wafer bonding; Annealing; Biomembranes; Bonding processes; Capacitive sensors; Electrodes; Etching; Manufacturing processes; Silicon; Ultrasonic transducers; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Sensors, 2006. 5th IEEE Conference on
Conference_Location
Daegu
ISSN
1930-0395
Print_ISBN
1-4244-0375-8
Type
conf
DOI
10.1109/ICSENS.2007.355866
Filename
4178861
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