DocumentCode :
2498052
Title :
A high performance and highly reliable dual gate CMOS with gate/n/sup -/ overlapped LDD applicable to the cryogenic operation
Author :
Inuishi, M. ; Mitsui, K. ; Kusunoki, S. ; Shimizu, M. ; Tsukamoto, K.
Author_Institution :
Mitsubishi Electr. Corp., Hyogo, Japan
fYear :
1989
fDate :
3-6 Dec. 1989
Firstpage :
773
Lastpage :
776
Abstract :
A dual-gate CMOS structure has been developed which features an overlap LDD (lightly doped drain) NMOS with n/sup +/ poly gate and a surface channel PMOS with p/sup +/ poly gate whose source/drain and gate were salicided with low-resistance TiSi/sub 2/. The gate/n/sup -/ overlapped structure was fabricated by rotational oblique ion implantation. This CMOS structure can realize low-supply-voltage operation due to the small absolute value of threshold voltage without punchthrough. It is demonstrated that, using the overlap LDD NMOS, the circuit speed and the reliability can be improved, compared with the single and the conventional LDD NMOS. The cryogenic operation of the structure is examined.<>
Keywords :
CMOS integrated circuits; integrated circuit technology; ion implantation; metallisation; titanium compounds; TiSi/sub 2/; circuit speed; cryogenic operation; dual-gate CMOS structure; gate/n/sup -/ overlapped structure; low-supply-voltage operation; overlap LDD; polycrystalline Si; reliability; rotational oblique ion implantation; salicided metallisation; surface channel PMOS; threshold voltage without punchthrough; Boron; Cryogenics; Heat treatment; Ion implantation; Large scale integration; Low voltage; MOS devices; MOSFETs; Silicidation; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1989. IEDM '89. Technical Digest., International
Conference_Location :
Washington, DC, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-0817-4
Type :
conf
DOI :
10.1109/IEDM.1989.74168
Filename :
74168
Link To Document :
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