Space charge behaviour and ion migration in a printed wiring board

Author

Fukunaga, K. ; Maeno, T. ; Okamoto, K.

Author_Institution

Commun. Res. Lab., Minist. of Posts & Telecommun., Tokyo, Japan

fYear

1998

fDate

27-30 Sep 1998

Firstpage

105

Lastpage

107

Abstract

We used the pulsed electroacoustic (PEA) space charge measurement system to observe copper ion migration occurring in an insulation layer of a metal-base PWB, and compared the space charge profile with ion impurities detected by ion chromatography and copper distribution observed by EPMA. We show that the space charge measurement is effective for investigating not only high-voltage insulation, but also electronic insulation

Keywords

acoustoelectric effects; charge measurement; chromatography; composite insulating materials; copper; electromigration; electron probe analysis; epoxy insulation; insulation testing; life testing; power electronics; printed circuit testing; pulse measurement; silicon compounds; space charge; EPM; SiO₂-Cu; accelerated ageing test; copper distribution; copper ion migration; electronic insulation; epoxy-SiO₂ filled insulation; high-voltage insulation; insulation layer; ion chromatography; ion impurities; ion migration; metal-base PWB; printed wiring board; pulsed electroacoustic space charge measurement; space charge behaviour; space charge profile; Aging; Charge measurement; Circuits; Copper; Current measurement; Electrodes; Electrons; Insulation; Space charge; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on

Conference_Location

Toyohashi

Print_ISBN

4-88686-050-8

Type

conf

DOI

10.1109/ISEIM.1998.741696

Filename

741696