Title :
Space charge behaviour and ion migration in a printed wiring board
Author :
Fukunaga, K. ; Maeno, T. ; Okamoto, K.
Author_Institution :
Commun. Res. Lab., Minist. of Posts & Telecommun., Tokyo, Japan
Abstract :
We used the pulsed electroacoustic (PEA) space charge measurement system to observe copper ion migration occurring in an insulation layer of a metal-base PWB, and compared the space charge profile with ion impurities detected by ion chromatography and copper distribution observed by EPMA. We show that the space charge measurement is effective for investigating not only high-voltage insulation, but also electronic insulation
Keywords :
acoustoelectric effects; charge measurement; chromatography; composite insulating materials; copper; electromigration; electron probe analysis; epoxy insulation; insulation testing; life testing; power electronics; printed circuit testing; pulse measurement; silicon compounds; space charge; EPM; SiO2-Cu; accelerated ageing test; copper distribution; copper ion migration; electronic insulation; epoxy-SiO2 filled insulation; high-voltage insulation; insulation layer; ion chromatography; ion impurities; ion migration; metal-base PWB; printed wiring board; pulsed electroacoustic space charge measurement; space charge behaviour; space charge profile; Aging; Charge measurement; Circuits; Copper; Current measurement; Electrodes; Electrons; Insulation; Space charge; Wiring;
Conference_Titel :
Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
Conference_Location :
Toyohashi
Print_ISBN :
4-88686-050-8
DOI :
10.1109/ISEIM.1998.741696
