• DocumentCode
    2498625
  • Title

    Determining Thermal Properties of Liquids: Membrane-based versus Bridge-based Micromachined Sensors

  • Author

    Kuntner, J. ; Jachimowicz, A. ; Kohl, F. ; Jakoby, B.

  • Author_Institution
    Vienna Univ. of Technol. Vienna, Vienna
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    1411
  • Lastpage
    1414
  • Abstract
    For the determination of thermal material properties, micromachined sensors are of particular interest. Membrane-based structures facilitate an effective thermal decoupling of the actual sensing region from the sensor substrate, resulting in high sensitivity and a short response time. For some liquids, however, the remaining spurious heat flow in the membrane is still not negligible. These unwanted thermal shunts can be further decreased by utilizing structures, like cantilevers or micro-bridges. To investigate this aspect experimentally, two different sensors were designed, both intended to determine the thermal conductivity and diffusivity of liquids using a heating element and a spatially separated temperature sensor. In the former case, heater and thermistor are located on a closed membrane structure whereas in the latter case the membrane is selectively patterned yielding an individual micro-bridge for each element. The measurement results confirm, that the novel bridge-based sensor allows to determine the thermal properties more accurately and independently from the thermal properties of the membrane.
  • Keywords
    beams (structures); cantilevers; membranes; microsensors; temperature sensors; thermal conductivity measurement; thermal properties; thermistors; bridge-based micromachined sensors; cantilevers; heater; liquids; membrane-based micromachined sensors; membrane-based structures; microbridges; spurious heat flow; temperature sensor; thermal conductivity; thermal decoupling; thermal properties; thermal shunts; thermistor; Biomembranes; Delay; Liquids; Material properties; Sensor phenomena and characterization; Sensor systems; Temperature sensors; Thermal conductivity; Thermal sensors; Thermistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355896
  • Filename
    4178891